Shenzhen Xinyinglong Electronic Technology Co., Ltd.
Shenzhen Xinyinglong Electronic Technology Co., Ltd.
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JUKI NOZZLE 509 40025165 For SMT Pick And Place Machine Ocean Transport, Air Transport, Air Express Services
Description:
Surface mounting was originally called "planar mounting".
Surface-mount technology was developed in the 1960s and became widely used in the mid 1980s. By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices. Much of the pioneering work in this technology was done by IBM. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the launch Vehicle Digital Computer used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and smaller circuit boards and, in turn, machines or subassemblies containing the boards.
JUKI Nozzle Specifications:
| Brand Name | JUKI 509 NOZZLE |
| Part Number | 40025165 |
| Model | JUKI NOZZLE 509 |
| Warranty | 1 month |
| Usage for Machine | JUKI KE2000 FX SERIES MACHINE |
| Delivery Terms | EXW |
Supply Ability:
Supply all original new and used JUKI Nozzle at good price:
Related Advantages:
| Part Number | Description |
| 40001339 | 501 0.7×0.4Φ0.25 Hole |
| 40001340 | 502 Φ0.7/Φ0.35 |
| 40001342 | 504 Φ1.5/Φ1.0 |
| 40001343 | 505 Φ3.5/Φ1.7 |
| E3608-729-0A0 | 500 1.0×0.5Φ0.3×2 Hole |
| E3600-729-0A0 | 501 0.7×0.4Φ0.2×2 Hole |
| E3601-729-0A0 | 502 Φ0.7/Φ0.4 |
| E3606-729-0A0 | 507 Φ8.5/Φ5.0 |
| E3607-729-0A0 | 508 Φ9.5/Φ8.0 |
| E3616-729-0A0 | 511 MELF Φ2.0/Φ1.2 |
| E3622-729-0A0 | 517 9.0×3.4 for Connectors |
| E3504-721-0A0 | 104 Φ4.0/Φ3.2 |
Business Scope:
This website has been created primarily to be a technical resource for surface mount process engineers and also for anyone with an interest in surface mount technology. The scope of the website will be all aspects of the manufacturing process from solder paste printing, solder paste inspection, component placement, and will include answers to the many frequently asked question.
